“TECHPOLYMER” is a polymer particle based on various hydrophobic vinyl monomers. It can be customized by adjusting the average particle size and refractive index and by adding heat resistance and solvent resistance, and is used in a variety of applications such as diffusion materials for LED displays and matting agent for paints and inks.
In recent years, the development of semiconductor insulating materials for high-frequency signals for next-generation high-speed communications has been gaining momentum. The suppression of transmission loss is an urgent issue for high-frequency signal processing, and the development of new materials and technologies with low dielectric constant and dissipation factor is required.
SEKISUI KASEI is developing hollow polymer microparticles with excellent low-dielectric properties by applying technology to control the microparticle structure. In collaboration with a research team including Pro. Dr. Hideto Minami in Department of Chemical Science and Engineering at Kobe University, we have succeeded in producing hollow particles of polyimide, a super-engineering plastic that is difficult to process.

• ・Hollow particle based on low dielectric resin, the inside of which is an insulator
• ・No resin penetration into the particle interior, even when mixed or melt-blended with base resin, maintaining the hollow structure
• ・Low dielectric resin particles with a hollow structure can be made smaller in diameter and more heat-resistant, making them applicable to a variety of semiconductor insulating materials

• ・Spherical microparticles made of polyimide and have hollow structures.
• ・Highly heat resistant and chemical stability, and have superb mechanical properties.
• ・Lightweight and excellent insulation from interior hollow structure.